Mo/Cu & W/Cu Heatsink Products
Our MoCu and WCu material has used in heatsink application which will be brazed with Kovar and ceramic plate.
We provide blank , machined and plated products.
| Material | WCu | 70/30 | 75/25 | 80/20 | 85/15 | 90/10 |
| Tungsten content | % | 70±3 | 75±3 | 80±2 | 85±2 | 90±2 |
| Copper content | % | 30±3 | 25±3 | 20±2 | 15±2 | 10±2 |
| Density | g/cm² | 14.3±0.2 | 15.0±0.3 | 15.6±0.3 | 16.4±0.3 | 17.3±0.3 |
| Hardness | HB2.5/62.5 | 160-220 | 160-220 | 180-240 | 190-260 | 220-290 |
Median coefficient of linear thermal expansion (20-100℃) |
10-8/K | 8.8 | 8.5 | 8.3 | 7.2 | 6.1 |
| (20-300℃) | 10-8/K | 9.2 | 9.0 | 8.7 | 7.6 | 6.4 |
| (20-450℃) | 10-8/K | 9.5 | 9.2 | 9.0 | 8.0 | 6.7 |
| Young's modulus | GPa | 220 | 240 | 280 | 290 | 340 |
| Ultimate tensile strength | MPa | ≥350 | ≥400 | ≥440 | ≥460 | ≥480 |
| Electrical conductivity | %IACS MS/m |
≥30 ≥18 |
≥27 ≥16 |
≥25 ≥14.5 |
≥25 ≥14.5 |
≥25 ≥14.5 |
| Specific electrical resistance | Ωmm²/m | ≤0.040 | ≤0.047 | ≤0.050 | ≤0.050 | ≤0.052 |
| Thermal conductivity*2 | W/mK | 150-240 | 145-230 | 140-220 | 135-210 | 130-200 |
| Material | MoCu | 65/35 | 70/30 | 80/20 | 85/15 |
| Molybdenum content | % | 65±3 | 70±3 | 80±2 | 85±2 |
| Copper content | % | 35±3 | 30±3 | 20±2 | 15±2 |
| Density | g/cm² | 9.7±0.2 | 9.8±0.2 | 9.9±0.2 | 10.0±0.2 |
| Hardness | HB2,5/62,5 | 120-160 | 130-170 | 135-175 | 140-180 |
Median coefficient of linear thermal expansion (20-100℃) |
10-8/K | 8.6 | 8.2 | 6.3 | 6.2 |
| (20-300℃) | 10-8/K | 9.2 | 8.6 | 6.4 | 6.3 |
| (20-450℃) | 10-8/K | 9.6 | 8.8 | 6.6 | 6.5 |
| Young's modulus | GPa | 200 | 210 | 220 | 230 |
| Ultimate tensile strength | MPa | ≥280 | ≥290 | ≥300 | ≥320 |
| Electrical conductivity | %|ACS MS/m |
≥47 ≥27 |
≥45 ≥26 |
≥35 ≥20 |
≥32 ≥18 |
| Specific electrical resistance | Ωmm²/m | ≤0.040 | ≤0.038 | ≤0.042 | ≤0.042 |
| Thermal conductivity | W/mK | ≥200 | ≥190 | ≥170 | ≥160 |
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